What is Hybrid air and liquid cooling?
Most direct-to-chip deployments are hybrid at the rack level. Cold plates remove GPU and CPU heat while fans and room or rear-door systems handle memory, power, storage, and network components.
Cooling architecture • Technology
A facility combines liquid capture at high-heat components with air cooling for the rest of the rack.
Architecture
Most direct-to-chip deployments are hybrid at the rack level. Cold plates remove GPU and CPU heat while fans and room or rear-door systems handle memory, power, storage, and network components.
Why teams choose it
What to validate
Connected records
A global critical-infrastructure supplier spanning thermal management, liquid cooling, power, controls, and prefabricated systems for data centers.
An energy-management and automation group with an expanding chip-to-chiller portfolio for high-density and AI data centers.
A global climate company combining chillers, heat rejection, controls, and LiquidStack liquid-cooling technology for data centers.
A thermal-management company whose data-center portfolio includes perimeter, ceiling, and liquid-cooling infrastructure through Airedale.
Connected records
CDUs control flow, pressure, temperature, water quality, and heat exchange between facility and technology cooling loops.
Fan and coil systems that condition and move air through rooms, galleries, or modular data halls.
Mechanical-refrigeration systems that produce chilled or elevated-temperature water for facility cooling loops.
Connected records
Submer announced a 56 MW owned and operated liquid-cooled data center in Barcelona as a showcase for its facility platform.
The Government of Madhya Pradesh and Submer signed an MoU covering up to 1 GW of liquid-cooled, AI-ready data-center capacity.
An undisclosed U.S. data-center operator ordered 300 MW of LiquidStack CDU-1MW capacity for multiple AI-ready sites.
Evidence ledger
Profiles distinguish company-reported claims from confirmed operating data. Open the original materials before relying on a specification.
Direct answers
Concise answers generated from the structured record and its cited evidence.
Most direct-to-chip deployments are hybrid at the rack level. Cold plates remove GPU and CPU heat while fans and room or rear-door systems handle memory, power, storage, and network components.
Hybrid air and liquid cooling is classified as scaling technology. Broadly applicable from 30–150+ kW racks.
Supports phased migration from air to liquid; Preserves compatibility with mixed hardware fleets; Lets operators target liquid cooling where it creates the most value.