Cooling technology Technology

Direct-to-chip liquid cooling

A liquid loop moves heat from processor-mounted cold plates to a CDU and then to facility heat rejection.

DLCcold platesCDUAI racks
MaturityScaling
Cooling mediumWater or water-glycol on the technology loop
Typical applicationCommonly selected for 50–150+ kW AI racks

Architecture

How heat moves

Direct-to-chip cooling places a cold plate on high-heat components such as GPUs and CPUs. A technology cooling system circulates water or water-glycol through the rack, while a CDU provides isolation, flow control, filtration, and heat exchange with the facility loop.

01Chip
02cold plate
03TCS loop
04CDU
05facility loop

Why teams choose it

  • Targets the largest heat sources directly
  • Retains familiar rack and server service models
  • Can support warm-water operation and heat reuse

What to validate

  • Connections, water quality, and leak detection require disciplined operations
  • Residual air cooling may still be needed for memory, power supplies, and networking
  • CDU sizing and redundancy must align with the compute rollout

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Evidence ledger

Primary sources

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Direct answers

Frequently asked questions

Concise answers generated from the structured record and its cited evidence.

What is Direct-to-chip liquid cooling?

Direct-to-chip cooling places a cold plate on high-heat components such as GPUs and CPUs. A technology cooling system circulates water or water-glycol through the rack, while a CDU provides isolation, flow control, filtration, and heat exchange with the facility loop.

Where is Direct-to-chip liquid cooling typically used?

Direct-to-chip liquid cooling is classified as scaling technology. Commonly selected for 50–150+ kW AI racks.

What are the main advantages of Direct-to-chip liquid cooling?

Targets the largest heat sources directly; Retains familiar rack and server service models; Can support warm-water operation and heat reuse.