Rack-scale demonstration • Deployment
SoftBank, ZutaCore, and Foxconn demonstrated a rack-integrated two-phase direct-to-chip system using NVIDIA H200 GPUs.
Project brief
The companies reported an operational demonstration and performance evaluation at a SoftBank data center in February 2025. The rack used ZutaCore HyperCool and was reported to pass NVIDIA temperature testing with a measured partial PUE of 1.03 for the rack cooling setup.
Status is labeled from public evidence. Supplier orders, MoUs, pilots, projects under delivery, and operating sites are not counted as equivalent.
Connected records
Connected records
Connected records
Processor-mounted heat exchangers that move GPU, CPU, memory, or power-electronics heat into a liquid loop.
CDUs control flow, pressure, temperature, water quality, and heat exchange between facility and technology cooling loops.
Evidence ledger
Profiles distinguish company-reported claims from confirmed operating data. Open the original materials before relying on a specification.
ZutaCore · May 21, 2025
Direct answers
Concise answers generated from the structured record and its cited evidence.
SoftBank–Foxconn H200 rack cooling pilot is tracked as pilot. It was announced on May 21, 2025, and the public record should not be interpreted as a later project stage without new evidence.
The source-reported capacity is One rack-scale demonstration. The project is located in Japan.
The record connects the project to Two Phase Direct To Chip.